LUXIC will exhibit at OFC2026, presenting a full range of optoelectronic chips including 200G/Lane for 1.6T optical modules in AI data centers, covering applications such as LPO, CPO, 12.8T XPO, 6.4T NPO, coherent optics, and USB4.0, with mass production and stable supply capability. Booth: #317.
ICC News — LUXIC, a leading provider of high-speed optoelectronic interface chip solutions, will s
owcase its 200G/Lane product family and a full lineup of optoelectronic chips for 1.6T optical modules tailored for AI data centers at the 51st OFC (Optical Fiber Communication Conference & Exposition). The event will be held at the Los Angeles Convention Center from March 17 to 19, 2026.
At this exhibition, LUXIC focuses on the core demands for ultra-high-speed, low-power, and highly integrated optical interconnects in the AI computing era. It will demonstrate on-site a variety of new products targeting cutting-edge technologies including 12.8T XPO, 6.4T NPO, 1.6T LPO, CPO, silicon photonics, and thin-film lithium niobate, demonstrating its technological breakthroughs and mass-production capabilities in high-speed optoelectronic chips.
1. 200G/Lane LPO-MSA Compliant Products (On-site Demo)：MZM driver and TIA products, deeply optimized for 12.8T XPO ultra-high-density pluggable applications, 6.4T NPO near-package optics, and 1.6T LPO low-power short-reach interconnects.
o Driver typical bandwidth up to 100GHz, CTLE compensation up to 13dB, the product channels covers multiple forms such as 4Ch/8Ch; 20% improvement in dynamic output amplitude range, overall power consumption is 20% lower than the previous generation, with power efficiency significantly outperforming similar products in the industry.
o New-generation 4x200G TIA with advanced 2.5D/3D packaging, delivering ultra-high sensitivity and ultra-low BER floor, the package size is further reduced, perfectly matching the requirements of high-density and compact LPO modules, and facilitating the rapid monetization of customers' 200G/Ln products.
2. New-Generation Coherent MZM Driver and TIA Series：Supporting baud rates up to 140GBaud, providing ultra-low-power solutions for 800G/1.6T coherent optical modules. Core device power consumption is reduced by 30% compared with the industry average, meeting ultra-high-speed transmission requirements for backbone networks and data center interconnection.
3. Custom Electrical Chipset for CPO/NPO Silicon Photonics Co-Packaging：In response to the characteristics of the 6.4T NPO board-level near package, where the optical engine is in close proximity to the switch chip, a dedicated chipset containing a highly integrated silicon photonics Driver array and a low-noise TIA array has been developed. Customized optimization of the signal transmission characteristics of the CPO optical engine has been carried out to achieve seamless docking between the optical engine and the switch chip, facilitating the large-scale commercial implementation of CPO/NPO technology by 2026.
4. USB4.0 High-Speed Optoelectronic Interface Chip Series (On-site Demo)：Fully compliant with USB4.0 specifications and backward compatible with Thunderbolt 3/4, USB3.2/3.1 and other legacy standards.
o Supports 40Gbps ultra-high-speed data transmission, while compatible with 8K@60Hz ultra-clear video transmission and up to 240W PD fast charging function.
o The chip integrates VCSEL transmit driver and PD receive TIA modules, featuring excellent EMI/RFI anti-interference capabilities and enabling lossless fiber optic transmission up to 30 meters.
o The chip size is optimized to the extreme to meet the requirements of ultra-miniaturized module packaging, with power consumption control reaching the industry's leading level. It is suitable for the high-speed interconnection requirements of multiple scenarios such as consumer electronics, industrial cameras, medical devices, VR devices, etc., providing a cost-effective core optoelectronic chip solution for USB4.0 ecosystem devices.
In 2026, driven by AI computing, the high-speed optical communications market is experiencing explosive growth. The global supply shortage of 800G/1.6T optical modules and core optoelectronic chips continues to widen, with extended industry lead times.
Against this backdrop, LUXIC has become a rare “reliable supplier” in the industry, backed by forward-looking capacity planning, vertical integration, and long-term expertise in high-speed electrical chips. It has pre-allocated production capacity for 100G/200G per lane Driver/TIA products across FRO/LRO/LPO/XPO/NPO applications, supporting both volume orders and urgent demands.
At OFC2026, LUXIC will make a strong appearance with full production capacity and latest product solutions. We sincerely invite you to visit our booth to explore cooperation opportunities and build a stable and efficient high-speed supply chain ecosystem.
LUXIC Booth: #317
We welcome global customers, partners and technical experts to experience our product performance firsthand and explore the future of optical communications in the AI computing era.
Founded in 2020, LUXIC Technology is a high-tech enterprise specializing in the R&D, manufacturing and sales of high-speed optoelectronic interface chips, committed to providing global customers with industry-leading chips and total solutions.
Its products cover AI data centers, coherent optical communications, 5G/6G optical networks, fiber-to-the-home, consumer optical communications, autonomous driving and automotive LiDAR. Keeping pace with cutting-edge trends including 12.8T XPO, 6.4T NPO, 1.6T LPO, silicon photonics and thin-film lithium niobate, LUXIC continuously achieves technological breakthroughs and product innovation.
LUXIC has established R&D and operation centers in Singapore, Shanghai, Suzhou, Guangzhou (China) and New Jersey, USA, building a global R&D and customer service network to empower the upgrading of the optical communications industry with core chip technologies.
Website: www.luxictech.com